CAPABILITY OF
SINGLE SIDE PCB
1 |
Material thickness |
0.4-1.6mm |
2 |
Copper thickness |
35µ (1oz) |
70µ (2oz) |
3 |
Minimum line width |
0.17mm |
0.17mm |
4 |
Minimum line spacing |
0.17mm |
0.17mm |
5 |
Smallest punched hole size |
Paper: 0.7mm |
Glass fabric: 0.8mm |
6 |
Hole size tolerance |
0.05mm |
7 |
Min. height + width of legend |
1.3mm |
0.3mm |
8 |
Spacing between PCB |
V-cut : |
0.3mm |
|
Push back: |
4.0mm |
|
Break apart: |
1.0mm |
9 |
Max punching surface |
300mm x 500mm |
10 |
Max hole quantity for tooling |
Paper: 3000 holes |
CEM: 2000 holes |
11 |
Tooling lead time |
1-2 weeks |
12 |
Electrical test |
No. of Max. test point: |
4096 |
13 |
Special surface treatment |
Golden plating: |
0.5-1 µm |
Carbon conductive ink: |
As per customer request |
OSP |
Water Solution Flux |
HASL |
Lead free |
Tin plating |
As per customer request |
CAPABILITY OF
DOUBLE SIDE PCB
1 |
Min. line width |
0.1mm (4 mil) |
2 |
Min. line spacing |
0.1mm (4mil) |
3 |
Min. finished hole size |
Mechanical drilling |
0.25mm (10mil) |
4 |
Max. board size |
533.4*609.6mm (21”*24”) |
CAPABILITY OF
MULTI-LAYER PCB
1 |
Max. layer count |
16 layers |
2 |
Min. thickness |
4 layer |
0.35mm (14mil) |
6 layer |
0.45mm (14mil) |
8 layer |
0.63mm (25mil) |
10 layer |
0.80mm (32mil) |
3 |
Max. thickness |
4-12 layer |
6 mm |
4 |
Min. SMD spacing |
0.3mm (12mil) |
5 |
Registration between layer |
0.1mm (04mil) |
6 |
Solder mask tolerance |
0.075mm (03mil) |